Invention Grant
- Patent Title: Process for attaching devices to a circuit board
- Patent Title (中): 将设备连接到电路板的过程
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Application No.: US14255811Application Date: 2014-04-17
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Publication No.: US09437997B2Publication Date: 2016-09-06
- Inventor: Bernard Gobeil , Todd Smiley , Jason McKay
- Applicant: Signalcraft Technologies
- Applicant Address: CA Calgary, Alberta
- Assignee: Signalcraft Technologies
- Current Assignee: Signalcraft Technologies
- Current Assignee Address: CA Calgary, Alberta
- Agency: Lee & Hayes, PLLC
- Main IPC: H05K3/00
- IPC: H05K3/00 ; H01R43/02 ; H01R12/70 ; H05K3/30 ; H05K3/34

Abstract:
Systems, methods and apparatuses for attaching devices to ends of a circuit board. An exemplary method includes removing or creating at least a portion of a sacrificial part of a circuit board based on a predefined pattern, inserting a holder device into a remaining portion of the sacrificial part of the circuit board, placing a device at a predefined location on the circuit board, wherein the device is at least partially supported by a portion of the holder device, attaching the device to the circuit board and removing the holder device and the sacrificial part of the circuit board.
Public/Granted literature
- US20140317917A1 APPARATUS AND PROCESS FOR ATTACHING DEVICES TO A CIRCUIT BOARD Public/Granted day:2014-10-30
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