An in-ear headphone with sound pick-up capability is disclosed. The in-ear headphone includes a pair of ear pieces. Each of the ear pieces includes an ear tip, an audio receiver and an acoustic-to-electric transducer. The ear tip is capable of being inserted into an ear canal. The audio receiver is configured for recovering sound signals from audio electrical signals and transmitting the sounds signals to the ear canal via the ear tip. The acoustic-to-electric transducer is disposed on the ear tip, and configured for sensing vibration of an inner wall of the ear canal and generating an electrical signal in accordance with the vibration.