Invention Grant
- Patent Title: Headphone structure for adjusting audio frequencies
- Patent Title (中): 用于调节音频的耳机结构
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Application No.: US14529179Application Date: 2014-10-31
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Publication No.: US09438989B2Publication Date: 2016-09-06
- Inventor: Ming-Chung Chu , Ping-Tang Lee
- Applicant: Huiyang Dongmei Audio Products Co., Ltd.
- Applicant Address: CN Huizhou
- Assignee: Huiyang Dongmei Audio Products Co., Ltd.
- Current Assignee: Huiyang Dongmei Audio Products Co., Ltd.
- Current Assignee Address: CN Huizhou
- Priority: CN201420351661u 20140627
- Main IPC: H04R1/28
- IPC: H04R1/28 ; H04R25/00 ; H04R1/22 ; H04R1/10

Abstract:
A headphone structure for adjusting audio frequencies is provided, which comprises a front housing, a rear housing, a sound-producing unit in the front housing and an elastic ear-contacting body sleeving the front housing. The front housing has at least one slot or recess, and the elastic ear-contacting body sleeves the front housing to form at least one gap. The headphone structure for adjusting audio frequencies of the present invention has better results for the adjustment of bass frequencies. In addition, the headphone structure of the present invention is not complicated and is easy to manufacture. The headphone structure of the present invention can be applied to various types of headphone, such as in-ear headphones and circumaural headphones.
Public/Granted literature
- US20150382099A1 HEADPHONE STRUCTURE FOR ADJUSTING AUDIO FREQUENCIES Public/Granted day:2015-12-31
Information query
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