Invention Grant
US09439291B2 Photosensitive element, method for forming resist pattern, and method for producing printed circuit board
有权
感光元件,抗蚀剂图案形成方法以及印刷电路板的制造方法
- Patent Title: Photosensitive element, method for forming resist pattern, and method for producing printed circuit board
- Patent Title (中): 感光元件,抗蚀剂图案形成方法以及印刷电路板的制造方法
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Application No.: US13994971Application Date: 2011-12-15
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Publication No.: US09439291B2Publication Date: 2016-09-06
- Inventor: Masao Kubota
- Applicant: Masao Kubota
- Applicant Address: JP Tokyo
- Assignee: HITACHI CHEMICAL COMPANY, LTD.
- Current Assignee: HITACHI CHEMICAL COMPANY, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Griffin and Szipl PC
- Priority: JPP2010-280604 20101216
- International Application: PCT/JP2011/079097 WO 20111215
- International Announcement: WO2012/081680 WO 20120621
- Main IPC: G03F7/40
- IPC: G03F7/40 ; G03F7/16 ; G03F7/09 ; H05K3/06 ; H05K3/00 ; G03F7/031 ; G03F7/085 ; G03F7/033 ; G03F7/20

Abstract:
The invention relates to a photosensitive element comprising a support film and a photosensitive layer derived from a photosensitive resin composition formed on the support film, wherein the support film haze is 0.01-1.5%, the total number of particles with diameters of 5 μm and larger and aggregates with diameters of 5 μm or larger in the support film is no greater than 5/mm2, the photosensitive layer contains a binder polymer, a photopolymerizable compound with an ethylenically unsaturated bond and a photopolymerization initiator, and the thickness T of the photosensitive layer and the absorbance A of the photosensitive layer at 365 nm satisfies the relationship represented by inequality (I): 0.001≦A/T≦0.020 (I).
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