Invention Grant
US09439291B2 Photosensitive element, method for forming resist pattern, and method for producing printed circuit board 有权
感光元件,抗蚀剂图案形成方法以及印刷电路板的制造方法

Photosensitive element, method for forming resist pattern, and method for producing printed circuit board
Abstract:
The invention relates to a photosensitive element comprising a support film and a photosensitive layer derived from a photosensitive resin composition formed on the support film, wherein the support film haze is 0.01-1.5%, the total number of particles with diameters of 5 μm and larger and aggregates with diameters of 5 μm or larger in the support film is no greater than 5/mm2, the photosensitive layer contains a binder polymer, a photopolymerizable compound with an ethylenically unsaturated bond and a photopolymerization initiator, and the thickness T of the photosensitive layer and the absorbance A of the photosensitive layer at 365 nm satisfies the relationship represented by inequality (I): 0.001≦A/T≦0.020  (I).
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