Invention Grant
- Patent Title: Hinge structure and electronic device
- Patent Title (中): 铰链结构和电子设备
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Application No.: US13930114Application Date: 2013-06-28
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Publication No.: US09439310B2Publication Date: 2016-09-06
- Inventor: Kumpei Fujita , Takashi Murakami
- Applicant: NINTENDO CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: NINTENDO CO., LTD.
- Current Assignee: NINTENDO CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Nixon & Vanderhye P.C.
- Priority: JP2012-156547 20120712
- Main IPC: E05D11/10
- IPC: E05D11/10 ; H05K5/02 ; G06F1/16

Abstract:
An exemplary embodiment provides a hinge structure capable of achieving improved durability. The hinge structure includes a hinge pin having a first member and a second member having one end surface and the other end surface provided at a distance from each other in an axial direction, having a protrusion portion provided to protrude from one end surface in the axial direction, arranged to be opposed to the first member at the other end surface, and being pivotable with respect to the first member, and a hinge pin reception portion having a recess portion fitting to a part of the second member and the protrusion portion of the hinge pin. The protrusion portion has a first surface portion extending in a radial direction of the second member. The recess portion has a second surface portion which can be engaged with the first surface portion.
Public/Granted literature
- US20140016250A1 HINGE STRUCTURE AND ELECTRONIC DEVICE Public/Granted day:2014-01-16
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