Invention Grant
- Patent Title: Attachment for ultrasonic probe, ultrasonic probe, electronic device, and ultrasonic diagnostic apparatus
- Patent Title (中): 超声波探头，超声波探头，电子设备及超声波诊断仪附件
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Application No.: US14015043Application Date: 2013-08-30
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Publication No.: US09439626B2Publication Date: 2016-09-13
- Inventor: Daisuke Nakanishi
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Global IP Counselors, LLP
- Priority: JP2012-192861 20120903
- Main IPC: A61B8/00
- IPC: A61B8/00 ; B06B3/00 ; B06B1/06
Abstract:
An attachment for an ultrasonic probe is adapted to be mounted onto an ultrasonic probe body of the ultrasonic probe. The attachment for an ultrasonic probe includes a cover member and a protective member. The cover member is configured and arranged to cover an ultrasonic wave emission surface of a head section of the ultrasonic probe body when the attachment is mounted onto the ultrasonic probe body. The protective member is provided to a surface of the cover member facing the ultrasonic wave emission surface, and configured and arranged to be in contact with the ultrasonic wave emission surface when the attachment is mounted onto the ultrasonic probe body.
Public/Granted literature
Information query
