Invention Grant
- Patent Title: Wrap around case
- Patent Title (中): 包装箱
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Application No.: US14940150Application Date: 2015-11-13
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Publication No.: US09440762B2Publication Date: 2016-09-13
- Inventor: Yusuke Kagawa , Nobuyuki Kimoto
- Applicant: FUJIFILM CORPORATION
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Solaris Intellectual Property Group, PLLC
- Priority: JP2014-238208 20141125
- Main IPC: B65D5/54
- IPC: B65D5/54 ; B65D5/02 ; B65D85/38 ; B65D5/42

Abstract:
A wrap around case including: a case body that includes a top face panel and a bottom face panel, a front face panel and a back face panel, and a pair of side face panels, and that is formed with a perforated tear section running along a ridgeline formed by the top face panel and each of the pair of side face panels; and an overlap section that extends from the top face panel toward the bottom face panel side and overlaps the front face panel, and that is formed with a gap to an edge portion at the bottom face panel side of a cutout portion formed at a position offset to one end side or another end side of the center, along the facing direction of the side face panels, of an edge portion at the top face panel side of the front face panel.
Public/Granted literature
- US20160144996A1 WRAP AROUND CASE Public/Granted day:2016-05-26
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