Invention Grant
- Patent Title: Curable composition, transparent heat-resistant material, and use thereof
- Patent Title (中): 可固化组合物,透明耐热材料及其用途
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Application No.: US14771010Application Date: 2014-02-27
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Publication No.: US09441064B2Publication Date: 2016-09-13
- Inventor: Hirofumi Inoue , Miyo Mukobayashi
- Applicant: SHOWA DENKO K.K.
- Applicant Address: JP Tokyo
- Assignee: SHOWA DENKO K.K.
- Current Assignee: SHOWA DENKO K.K.
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2013-039075 20130228; JP2013-199325 20130926
- International Application: PCT/JP2014/054793 WO 20140227
- International Announcement: WO2014/133052 WO 20140904
- Main IPC: C08F2/50
- IPC: C08F2/50 ; C08F2/46 ; C08G61/04 ; C08F222/10 ; C08F216/12 ; C09D4/00

Abstract:
The present invention provides a curable composition, which contains a crosslinking aid (B) containing three or more allyl groups in the molecule in an amount of 1 to 50 parts by mass, polyfunctional (meth)acrylic compound (C) in an amount of 5 to 50 parts by mass, and photopolymerization initiator (D1) and/or thermal polymerization initiator (D2) in an amount of 0.1 to 10 parts by mass, respectively, as a polymerization initiator (D) to 100 parts by mass of allyl group-terminated allyl ester oligomer (A); wherein the crosslinking aid (B) containing allyl group is a compound containing three or more allyl groups in a molecule; wherein the content of impurities derived from the crosslinking aid (B) in the curable composition is less than 0.1 mass %; wherein the content of the (meth)acrylic compound containing a hydroxyl group in a molecule (C1) in the curable composition is 0.5 to 30 mass %.
Public/Granted literature
- US20160017076A1 CURABLE COMPOSITION, TRANSPARENT HEAT-RESISTANT MATERIAL, AND USE THEREOF Public/Granted day:2016-01-21
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