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Invention Grant
US09441086B2 Curable silicone compositions, electrically conductive silicone adhesives, methods of making and using same, and electrical devices containing same 有权
可固化的硅氧烷组合物，导电性硅氧烷粘合剂，制造和使用它们的方法以及含有它们的电气装置

Curable silicone compositions, electrically conductive silicone adhesives, methods of making and using same, and electrical devices containing same
Abstract:
A curable silicone composition containing a curable organosiloxane composition, silver, and at least one electrically conductive metal other than silver, the curable silicone composition being characterizable by a total silver concentration of from 50 to less than 60 weight percent and a thixotropic index that is adjustable from 3 to 10 measured according to TI Test Method while the composition remains curable to an electrically conductive silicone adhesive having a volume resistivity of less than 0.001 Ohm-centimeter measured according to Volume Resistivity Test Method without increasing the total concentration of electrically conductive metal in the curable silicone composition to 72 weight percent or higher, the electrically conductive silicone adhesive, an electrical device comprising the electrically conductive silicone adhesive, and a method of manufacturing the electrical device.
Abstract(Chinese):

一种含有可固化的有机硅氧烷组合物，银和除了银以外的至少一种导电金属的可固化的硅氧烷组合物，可固化的有机硅组合物可以由总银浓度为50至小于60重量％表征，触变指数可调 根据TI测试方法测量的3至10，而组合物可固化至根据体积电阻率测试方法测量的体积电阻率小于0.001欧姆厘米的导电硅酮粘合剂，而不增加导电性金属的总浓度 可固化硅氧烷组合物至72重量％或更高，导电硅氧烷粘合剂，包括导电硅树脂粘合剂的电气装置，以及制造电气装置的方法。

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