Invention Grant
- Patent Title: Multilayer kick plate and method for preparing the same
- Patent Title (中): 多层踢脚板及其制备方法
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Application No.: US14722965Application Date: 2015-05-27
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Publication No.: US09441413B1Publication Date: 2016-09-13
- Inventor: Shih-Hao Fang
- Applicant: WELLSCO INTERNATIONAL GROUP CO., LTD.
- Applicant Address: CN Hangzhou, Zhejiang Province
- Assignee: Wellsco International Group Co., Ltd.
- Current Assignee: Wellsco International Group Co., Ltd.
- Current Assignee Address: CN Hangzhou, Zhejiang Province
- Agency: Fishman & Associates, LLC.
- Main IPC: E06B3/30
- IPC: E06B3/30

Abstract:
Provided is a multilayer kick plate, comprising a thin strip, a supporting strip, and a bonding film. The thin strip has a front surface and a back surface, and the front surface of the thin strip is polished by abrasive paper ranging from #800 to #890. The supporting strip has a bonding surface. The bonding film is mounted between the back surface of the thin strip and the bonding surface of the supporting strip. With said supporting strip and bonding film, the thin strip can be designed to be much thinner than the conventional thin strip, such that the production cost of the multilayer kick plate is reduced.
Information query
IPC分类: