Invention Grant
US09441952B2 Metrology tool for electroless copper thickness measurement for BBUL process development monitoring
有权
用于BBUL过程开发监测的无电铜厚度测量的计量工具
- Patent Title: Metrology tool for electroless copper thickness measurement for BBUL process development monitoring
- Patent Title (中): 用于BBUL过程开发监测的无电铜厚度测量的计量工具
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Application No.: US14040178Application Date: 2013-09-27
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Publication No.: US09441952B2Publication Date: 2016-09-13
- Inventor: Nilanjan Ghosh , Zhiyong Wang , Yu-Chun Chen , Shuhong Liu
- Applicant: Nilanjan Ghosh , Zhiyong Wang , Yu-Chun Chen , Shuhong Liu
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: G01B11/06
- IPC: G01B11/06 ; G01B11/02 ; H05K3/46
Abstract:
A method including measuring a first distance to a surface of an integrated circuit substrate or a portion of an integrated circuit package by measuring an angle to it from two known points; introducing a material onto the surface; measuring a second distance to a surface of the film from the two known points; and determining a thickness of the introduced material by subtracting the second distance from the first distance.
Public/Granted literature
- US20150092201A1 METROLOGY TOOL FOR ELECTROLESS COPPER THICKNESS MEASUREMENT FOR BBUL PROCESS DEVELOPMENT MONITORING Public/Granted day:2015-04-02
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