Invention Grant
- Patent Title: Multilayer ceramic electronic component and method for manufacturing multilayer ceramic electronic component
- Patent Title (中): 多层陶瓷电子元件及其制造方法
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Application No.: US14102594Application Date: 2013-12-11
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Publication No.: US09443654B2Publication Date: 2016-09-13
- Inventor: Koichi Banno , Shoichiro Suzuki , Taisuke Kanzaki , Akihiro Shiota
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2011-135284 20110617
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/005 ; H01G4/06 ; H01G4/232 ; H01G4/008 ; H01C7/00 ; H01F5/00 ; H01L41/083 ; H05K1/09 ; H01G4/12

Abstract:
A multilayer ceramic electronic component achieves a high electrostatic capacitance and includes an Al inner electrode superior in smoothness and conductivity. The multilayer ceramic electronic component includes a multilayer body including a plurality of stacked ceramic layers and a plurality of inner electrodes arranged along certain interfaces between the ceramic layers and containing Al as a main component, and an outer electrode located on an outer surface of the multilayer body. A surface of the inner electrode is covered with a layer including a noble metal or Ti as a main component.
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