An apparatus for picking and placing or for picking and transferring or for picking, placing and pressing semiconductor components (10) is disclosed. The apparatus (10) comprises a motor for generating power to rotate a turret (6) which holds a plurality of pick up heads (7), a plurality of pressers (8), wherein each of said pressers (8) is a voice coil assembly (3) which consist of voice coil actuator assemblies (31), at least one stationary frame (1, 2) to secure said voice coil assemblies (3) and a controller means to control the direction and magnitude of displacement of said voice coil actuator assemblies (31). When current flows into voice coil in said voice coil actuator assembly (31), electromagnetic force is generated in vertical direction, forcing said actuators to press said pick up heads (7) located directly below said actuators at a particular moment, which in turn reaches to and press on wafers or semiconductor components located below said pick up heads. The pressing force, speed and direction of each actuator can be controlled individually. Furthermore, this invention includes safety measures wherein a real time actuator position feedback system is used to confirm the displacement of said actuators and an urging device (35) is used to return the actuators back to their original position in the event of power outage.