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US09443758B2 Connecting techniques for stacked CMOS devices 有权
堆叠CMOS器件的连接技术

Connecting techniques for stacked CMOS devices
Abstract:
A stacked integrated circuit includes multiple tiers vertically connecting together. A multi-layer horizontal connecting structure is fabricated inside a substrate of a tier. Layers of the horizontal connecting structure have different patterns as viewed from above the substrate.
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