Invention Grant
- Patent Title: Electronic component and method
- Patent Title (中): 电子元器件及方法
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Application No.: US13963461Application Date: 2013-08-09
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Publication No.: US09443787B2Publication Date: 2016-09-13
- Inventor: Ralf Otremba , Klaus Schiess , Oliver Häberlen
- Applicant: Infineon Technologies Austria AG
- Applicant Address: AT Villach
- Assignee: Infineon Technologies Austria AG
- Current Assignee: Infineon Technologies Austria AG
- Current Assignee Address: AT Villach
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L23/48 ; H01L21/50 ; H01L23/00

Abstract:
An electronic component includes a high-voltage depletion-mode transistor, a low-voltage enhancement-mode transistor arranged adjacent and spaced apart from the high-voltage depletion-mode transistor, and an electrically conductive member electrically coupling a first current electrode of the high-voltage depletion-mode transistor to a first current electrode of the low-voltage enhancement-mode transistor. The electrically conductive member has a sheet-like form.
Public/Granted literature
- US20150041984A1 Electronic Component and Method Public/Granted day:2015-02-12
Information query
IPC分类: