Invention Grant
US09443808B2 Semiconductor wafer, semiconductor IC chip and manufacturing method of the same
有权
半导体晶片，半导体IC芯片及其制造方法相同
- Patent Title: Semiconductor wafer, semiconductor IC chip and manufacturing method of the same
- Patent Title (中): 半导体晶片，半导体IC芯片及其制造方法相同
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Application No.: US14329816Application Date: 2014-07-11
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Publication No.: US09443808B2Publication Date: 2016-09-13
- Inventor: Hisao Nakamura , Yuichi Nakagomi , Yasuhiro Kumagai
- Applicant: Synaptics Display Devices GK
- Applicant Address: JP Tokyo
- Assignee: SYNAPTICS DISPLAY DEVICES GK
- Current Assignee: SYNAPTICS DISPLAY DEVICES GK
- Current Assignee Address: JP Tokyo
- Agency: McGinn IP Law Group, PLLC
- Priority: JP2013-149392 20130718
- Main IPC: H01L23/544
- IPC: H01L23/544 ; H01L21/82 ; H01L29/06 ; H01L23/00 ; H01L23/58 ; H01L21/66 ; H01L23/31
Abstract:
A semiconductor wafer includes circuit integration regions each incorporating an integrated circuit and guard rings disposed to surround the circuit integration regions, respectively. A scribe region disposed between every adjacent two of the guard rings. An element and a pad electrically connected to the element are disposed in the scribe region. A groove is disposed along a corresponding guard ring on a front surface of the semiconductor wafer between the pad and the corresponding guard ring. The distance between the groove and the pad is varied along the corresponding guard ring.
Public/Granted literature
- US20150021733A1 SEMICONDUCTOR WAFER, SEMICONDUCTOR IC CHIP AND MANUFACTURING METHOD OF THE SAME Public/Granted day:2015-01-22
Information query
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