Invention Grant
US09443884B2 Method for manufacturing ESD device, ESD device and display panel
有权
ESD器件,ESD器件和显示面板的制造方法
- Patent Title: Method for manufacturing ESD device, ESD device and display panel
- Patent Title (中): ESD器件,ESD器件和显示面板的制造方法
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Application No.: US14368913Application Date: 2013-09-25
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Publication No.: US09443884B2Publication Date: 2016-09-13
- Inventor: Zhenfei Cai , Zhaohui Hao
- Applicant: BOE TECHNOLOGY GROUP CO., LTD. , BEIJING BOE DISPLAY TECHNOLOGY CO., LTD.
- Applicant Address: CN Beijing CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.,BEIJING BOE DISPLAY TECHNOLOGY CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.,BEIJING BOE DISPLAY TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Beijing CN Beijing
- Agency: Ladas & Parry LLP
- Priority: CN201310281912 20130705
- International Application: PCT/CN2013/084186 WO 20130925
- International Announcement: WO2015/000226 WO 20150108
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L23/60

Abstract:
There is disclosed a method for manufacturing an Electro Static Discharge (ESD) device, an ESD device and a display panel, which are capable of addressing an issue that static-electric charges accumulated on the array substrate damage the unformed ESD device and improving a yield ratio of the array substrate. The method includes forming a TFT, a first lead wire, wherein the first lead wire or the second lead wire comprises at least two separate lead-wire segments; depositing a layer of passivation thin film, and forming via-holes for connecting the at least two separate lead-wire segments on the layer of passivation thin film; depositing a layer of transparent conductive film on the substrate on which the via-holes are formed, wherein the layer of transparent conductive film connects the lead-wire segments by the via-holes.
Public/Granted literature
- US20150303223A1 METHOD FOR MANUFACTURING ESD DEVICE, ESD DEVICE AND DISPLAY PANEL Public/Granted day:2015-10-22
Information query
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