Invention Grant
- Patent Title: Vertical and planar TFTS on common substrate
- Patent Title (中): 普通基底上的垂直和平面TFTS
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Application No.: US14737544Application Date: 2015-06-12
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Publication No.: US09443887B1Publication Date: 2016-09-13
- Inventor: Carolyn Rae Ellinger , Christopher R. Morton
- Applicant: Eastman Kodak Company
- Applicant Address: US NY Rochester
- Assignee: EASTMAN KODAK COMPANY
- Current Assignee: EASTMAN KODAK COMPANY
- Current Assignee Address: US NY Rochester
- Agent William R. Zimmerli
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L29/786

Abstract:
An electronic component includes a first transistor on a substrate. The first transistor includes a first source, a first drain, a first gate dielectric, a first gate, and a first semiconductor channel having a first length. At least a portion of the first semiconductor channel extends in a direction parallel to the substrate. A vertical-support-element on the substrate has a first reentrant profile. A second transistor includes a second source, a second drain, a second gate dielectric, and a second gate having a second semiconductor channel. At least a portion of the second semiconductor channel extends in a direction orthogonal to the substrate in the first reentrant profile of the vertical-support-element.
Information query
IPC分类: