Invention Grant
- Patent Title: Transistor having metal diffusion barrier
- Patent Title (中): 具有金属扩散阻挡层的晶体管
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Application No.: US13948925Application Date: 2013-07-23
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Publication No.: US09443969B2Publication Date: 2016-09-13
- Inventor: King-Yuen Wong , Po-Chih Chen , Chen-Ju Yu , Fu-Chih Yang , Jiun-Lei Jerry Yu , Fu-Wei Yao , Ru-Yi Su , Yu-Syuan Lin
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW
- Agency: Hauptman Ham, LLP
- Main IPC: H01L29/778
- IPC: H01L29/778

Abstract:
A transistor includes a substrate, a channel layer over the substrate, an active layer over the channel layer, a metal diffusion barrier over the active layer, and a gate over the metal diffusion barrier. The active layer has a band gap discontinuity with the channel layer.
Public/Granted literature
- US20150028345A1 TRANSISTOR HAVING METAL DIFFUSION BARRIER AND METHOD OF MAKING THE SAME Public/Granted day:2015-01-29
Information query
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