Invention Grant
- Patent Title: Film wiring substrate and light emitting device
- Patent Title (中): 薄膜配线基板和发光装置
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Application No.: US14406710Application Date: 2013-05-10
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Publication No.: US09444021B2Publication Date: 2016-09-13
- Inventor: Yuhsuke Fujita , Kenichi Akamatsu
- Applicant: SHARP KABUSHIKI KAISHA
- Applicant Address: JP Osaka
- Assignee: SHARP KABUSHIKI KAISHA
- Current Assignee: SHARP KABUSHIKI KAISHA
- Current Assignee Address: JP Osaka
- Agency: Nixon & Vanderhye P.C.
- Priority: JP2012-136436 20120615
- International Application: PCT/JP2013/003003 WO 20130510
- International Announcement: WO2013/186982 WO 20131219
- Main IPC: H01J1/02
- IPC: H01J1/02 ; H01L33/48 ; H01L33/62 ; H01L33/50 ; H01L33/52 ; H05K1/02 ; H05K1/09 ; H05K1/18

Abstract:
The folding along the disposed direction of wiring patterns is prevented. Concave-convex shapes in a plan view for preventing the folding of a device as step portions in a plan view are provided on opposing sides of two conductive regions. A front edge side 3a1 of a convex shape in a plan view of a Cu foil layer 3a, which is one of the two conductive regions, is disposed to enter into a concave portion (on the side of a bottom side 3b2) of a concave shape in a plan view of a Cu foil layer 3b, which is the other conductive region, to prevent the folding along the disposed direction of wiring patterns.
Public/Granted literature
- US20150162502A1 FILM WIRING SUBSTRATE AND LIGHT EMITTING DEVICE Public/Granted day:2015-06-11
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