Invention Grant
- Patent Title: Optoelectronic semiconductor chip, optoelectronic semiconductor component, and a method for producing an optoelectronic semiconductor component
- Patent Title (中): 光电子半导体芯片,光电子半导体元件以及光电半导体元件的制造方法
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Application No.: US14118475Application Date: 2012-05-18
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Publication No.: US09444022B2Publication Date: 2016-09-13
- Inventor: Dominik Eisert , Torsten Baade , Michael Zitzlsperger
- Applicant: Dominik Eisert , Torsten Baade , Michael Zitzlsperger
- Applicant Address: DE
- Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee Address: DE
- Agency: DLA Piper LLP (US)
- Priority: DE102011050450 20110518
- International Application: PCT/EP2012/059278 WO 20120518
- International Announcement: WO2012/156514 WO 20121122
- Main IPC: H01L33/50
- IPC: H01L33/50 ; H01L33/44 ; H01L33/60 ; H01L33/52 ; H01L33/48 ; H01L33/56 ; H01L33/62

Abstract:
An optoelectronic semiconductor chip includes a semiconductor body that emits primary light, and a luminescence conversion element that emits secondary light by wavelength conversion of at least part of the primary light, wherein the luminescence conversion element has a first lamina fixed to a first partial region of an outer surface of the semiconductor body, the outer surface emitting primary light, and leaves free a second partial region of the outer surface, the luminescence conversion element has a second lamina fixed to a surface of the first lamina facing away from the semiconductor body and spaced apart from the semiconductor body, the first lamina is at least partly transmissive to the primary radiation, a section of the second lamina covers at least the second partial region, and at least the section of the second lamina is designed to be absorbent and/or reflective and/or scattering for the primary radiation.
Public/Granted literature
Information query
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