Invention Grant
- Patent Title: Method for manufacture of multi-layer wire structure for high efficiency wireless communication
- Patent Title (中): 用于高效无线通信的多层线结构的制造方法
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Application No.: US14059100Application Date: 2013-10-21
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Publication No.: US09444213B2Publication Date: 2016-09-13
- Inventor: Vinit Singh , Christine A. Frysz , Matthew Geary , Eitan Babcock , Justin Derbas , Alberto Peralta
- Applicant: NUCURRENT, INC.
- Applicant Address: US IL Chicago
- Assignee: NuCurrent, Inc.
- Current Assignee: NuCurrent, Inc.
- Current Assignee Address: US IL Chicago
- Agency: McDermott Will & Emery LLP
- Main IPC: H01R43/20
- IPC: H01R43/20 ; A61N1/372 ; H01Q7/00
Abstract:
A structure for wireless communication having a plurality of insulator layers, a conductor layer separating each of the insulator layers, and at least one connector connecting two conductor layers wherein an electrical resistance is reduced when an electrical signal is induced in the resonator at a predetermined frequency.
Public/Granted literature
- US20140047713A1 METHOD FOR MANUFACTURE OF MULTI-LAYER WIRE STRUCTURE FOR HIGH EFFICIENCY WIRELESS COMMUNICATION Public/Granted day:2014-02-20
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