A resonation element includes a basal portion, resonating arms extending out in a Y-axis direction from the basal portion, and a vibration substrate, formed of single crystal silicon, in which a Z-axis direction is set to a thickness direction, and is configured such that the resonating arms are flexurally vibrated in an XY in-plane direction. In addition, when resonation frequencies of the resonating arms are set to F [kHz], widths of the resonating arms are set to W [μm], and lengths of the resonating arms are set to L [μm], at least one expression of the following Expression (1) and the following Expression (2) is satisfied. W