Invention Grant
US09444510B2 Method and apparatus for incorporating passive devices in an integrated passive device separate from a die
有权
用于将集成无源器件中的无源器件与管芯分离的方法和装置
- Patent Title: Method and apparatus for incorporating passive devices in an integrated passive device separate from a die
- Patent Title (中): 用于将集成无源器件中的无源器件与管芯分离的方法和装置
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Application No.: US14627354Application Date: 2015-02-20
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Publication No.: US09444510B2Publication Date: 2016-09-13
- Inventor: Poh Boon Leong , Albert Wu , Long-Ching Wang , Sehat Sutardja
- Applicant: Marvell World Trade LTD.
- Applicant Address: BB St. Michael
- Assignee: MARVELL WORLD TRADE LTD.
- Current Assignee: MARVELL WORLD TRADE LTD.
- Current Assignee Address: BB St. Michael
- Main IPC: H04B1/38
- IPC: H04B1/38 ; H04B1/40 ; H01L21/768 ; H01L23/48 ; H01L23/495 ; H01L23/66 ; H01L23/00 ; H01L25/16 ; H01L25/00 ; H04B1/00 ; H04B15/04 ; H01L23/64 ; H01L49/02
Abstract:
A circuit including a first die, an integrated passive device and a second layer. The first die includes a first substrate and active devices. The integrated passive device includes a first layer, a second substrate and passive devices. The second substrate includes vias. The passive devices are implemented at least on the first layer or the second substrate. A resistivity per unit area of the second substrate is greater than a resistivity per unit area of the first substrate. The second layer is disposed between the first die and the integrated passive device. The second layer includes pillars. Each of the pillars connects a corresponding one of the active devices to (i) one of the vias, or (ii) one of the passive devices. The first die, the integrated passive device and the second layer are disposed relative to each other to form a stack.
Public/Granted literature
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