Invention Grant
- Patent Title: Film system for LED applications
- Patent Title (中): LED应用电影系统
-
Application No.: US13635122Application Date: 2011-03-11
-
Publication No.: US09445490B2Publication Date: 2016-09-13
- Inventor: Peter Waegli , Markus Rees
- Applicant: Peter Waegli , Markus Rees
- Applicant Address: DE
- Assignee: Eppsteinfoils GmbH & Co. KG
- Current Assignee: Eppsteinfoils GmbH & Co. KG
- Current Assignee Address: DE
- Agency: Emerson, Thomson & Bennett
- Agent Roger D. Emerson
- Priority: DE102010011604 20100316
- International Application: PCT/EP2011/053705 WO 20110311
- International Announcement: WO2011/113762 WO 20110922
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H01L33/64 ; H05K1/18 ; H05K3/00 ; H05K3/02 ; H01L25/075

Abstract:
The present invention relates to a composite assembly of plastic (1, 3) and metal films (2.1, 2.2) which can be used for the interconnection and connection of light-emitting diodes (LEDs) (5). For this purpose, a flexible printed circuit board is provided, to which at least one radiation source is applied and which consists of a film system. The flexible printed circuit board has a thermal connection (6) to a heat sink (4) and the film system is composed at least of an insulating carrier layer and a metal film. The insulating carrier layer is opened at the locations at which the thermal connection to the heat sink is produced, and the metal film is subdivided into different sections.
Public/Granted literature
- US20130039013A1 FILM SYSTEM FOR LED APPLICATIONS Public/Granted day:2013-02-14
Information query