Invention Grant
- Patent Title: Epoxy resin composition and printed circuit board using same
- Patent Title (中): 环氧树脂组合物和使用其的印刷电路板
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Application No.: US14652031Application Date: 2013-12-06
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Publication No.: US09445500B2Publication Date: 2016-09-13
- Inventor: Myeong Jeong Kim , Jae Man Park , Jeungook Park , Sungjin Yun , Jong Heum Yoon
- Applicant: LG INNOTEK CO., LTD.
- Applicant Address: KR Seoul
- Assignee: LG INNOTEK CO., LTD.
- Current Assignee: LG INNOTEK CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: KED & Associates, LLP
- Priority: KR10-2012-0146498 20121214
- International Application: PCT/KR2013/011315 WO 20131206
- International Announcement: WO2014/092404 WO 20140619
- Main IPC: H05K1/05
- IPC: H05K1/05 ; B32B15/092 ; B23B27/20 ; B32B27/26 ; B32B27/38 ; C08G59/24 ; C08G59/50 ; C08K3/22 ; C08L63/00 ; H05K1/03 ; C08K3/38 ; C09K5/14 ; C08G59/22
Abstract:
The epoxy resin composition according to one embodiment of the present invention contains an epoxy compound, a curing agent, and an inorganic filler, wherein the inorganic filler contains spherical alumina (Al2O3).
Public/Granted literature
- US20150334827A1 EPOXY RESIN COMPOSITION AND PRINTED CIRCUIT BOARD USING SAME Public/Granted day:2015-11-19
Information query
