Invention Grant
- Patent Title: Solder alloy, solder paste, and electronic circuit board
- Patent Title (中): 焊锡合金,焊膏和电子电路板
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Application No.: US14414453Application Date: 2013-06-25
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Publication No.: US09445508B2Publication Date: 2016-09-13
- Inventor: Kensuke Nakanishi , Kosuke Inoue , Kazuya Ichikawa , Tetsuyuki Shigesada , Tadashi Takemoto
- Applicant: HARIMA CHEMICALS, INCORPORATED
- Applicant Address: JP Hyogo
- Assignee: HARIMA CHEMICALS, INCORPORATED
- Current Assignee: HARIMA CHEMICALS, INCORPORATED
- Current Assignee Address: JP Hyogo
- Agency: Buchanan, Ingersoll & Rooney PC
- Priority: JP2012-160239 20120719; JP2013-029247 20130218
- International Application: PCT/JP2013/067392 WO 20130625
- International Announcement: WO2014/013847 WO 20140123
- Main IPC: C22C13/00
- IPC: C22C13/00 ; C22C13/02 ; B23K35/26 ; H05K3/34 ; B23K35/02 ; H05K1/09

Abstract:
A solder alloy is a tin-silver-copper solder alloy, and contains tin, silver, copper, bismuth, nickel, and cobalt. Relative to the total amount of the solder alloy, the silver content is 2 mass % or more and 4 mass % or less, the nickel content is 0.01 mass % or more and 0.15 mass % or less, and the cobalt content is 0.001 mass % or more and 0.008 mass % or less.
Public/Granted literature
- US20150305167A1 SOLDER ALLOY, SOLDER PASTE, AND ELECTRONIC CIRCUIT BOARD Public/Granted day:2015-10-22
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