Invention Grant
US09445510B2 Galvanic process for filling through-holes with metals, in particular of printed circuit boards with copper
有权
用于用金属填充通孔的电镀工艺，特别是具有铜的印刷电路板
- Patent Title: Galvanic process for filling through-holes with metals, in particular of printed circuit boards with copper
- Patent Title (中): 用于用金属填充通孔的电镀工艺，特别是具有铜的印刷电路板
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Application No.: US11661704Application Date: 2005-08-30
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Publication No.: US09445510B2Publication Date: 2016-09-13
- Inventor: Bert Reents , Thomas Pliet , Bernd Roelfs , Toshiya Fujiwara , Rene Wenzel , Markus Youkhanis , Soungsoo Kim
- Applicant: Bert Reents , Thomas Pliet , Bernd Roelfs , Toshiya Fujiwara , Rene Wenzel , Markus Youkhanis , Soungsoo Kim
- Applicant Address: DE Berlin
- Assignee: Atotech Deutschland GmbH
- Current Assignee: Atotech Deutschland GmbH
- Current Assignee Address: DE Berlin
- Agency: Renner, Otto, Boisselle & Sklar, LLP
- Priority: DE102004045451 20040920
- International Application: PCT/EP2005/009332 WO 20050830
- International Announcement: WO2006/032346 WO 20060330
- Main IPC: C25D5/18
- IPC: C25D5/18 ; C25D3/38 ; C25D21/12 ; H05K3/42 ; C25D7/12
Abstract:
The present invention relates to a galvanic process for filling through-holes with metals. The process is particularly suitable for filling through-holes of printed circuit boards with copper. The process comprises the following steps: (i) formation of a narrow part in the center of a through-hole by electroplating; and (ii) filling the through-hole obtained in step (i) with metal by electroplating.
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