The invention relates to an electronic assembly comprising a plurality of electronic component groups and a cooling device for cooling the electronic component groups. The cooling device provides a cooling-power distributor. A cooling power of the cooling device can be individually controlled by the cooling-power distributor for every component group. Furthermore, the assembly provides temperature-registering means for every component group for registering a temperature of every component group, and a load-determining device for determining a parameter for every component group which describes the load experienced by a component group on the basis of the temperature registered for this component group. A control unit controls the cooling-power distributor on the basis of the parameters determined for the component groups.