Invention Grant
- Patent Title: High-frequency module
- Patent Title (中): 高频模块
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Application No.: US14440437Application Date: 2013-11-05
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Publication No.: US09445535B2Publication Date: 2016-09-13
- Inventor: Takuya Kouya , Masanobu Yukumatsu , Asahi Kondo
- Applicant: DENSO CORPORATION
- Applicant Address: JP Kariya, Aichi-pref.
- Assignee: DENSO CORPORATION
- Current Assignee: DENSO CORPORATION
- Current Assignee Address: JP Kariya, Aichi-pref.
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2012-243537 20121105
- International Application: PCT/JP2013/079894 WO 20131105
- International Announcement: WO2014/069658 WO 20140508
- Main IPC: H04B3/28
- IPC: H04B3/28 ; H05K9/00 ; H01P1/212 ; H01P1/203

Abstract:
A high-frequency module includes a substrate, an integrated circuit mounted to the substrate, a cylindrical shield enclosing the integrated circuit to block radio waves, a casing provided on an opposite side of the substrate relative to the shield to block radio waves, and a choke portion provided in an inner wall of the casing, the inner wall being opposed to the shield, or provided in the substrate, with a predetermined gap being formed relative to the shield, to create an antiphase in radio waves having a predetermined frequency emitted from the integrated circuit into a space above the substrate.
Public/Granted literature
- US20150289419A1 HIGH-FREQUENCY MODULE Public/Granted day:2015-10-08
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