Invention Grant
- Patent Title: Expandable interbody implant and methods of use
- Patent Title (中): 可扩展体间植入物和使用方法
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Application No.: US13329845Application Date: 2011-12-19
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Publication No.: US09445919B2Publication Date: 2016-09-20
- Inventor: Stanley T. Palmatier , Keith E. Miller , Anthony J. Melkent , William D. Armstrong
- Applicant: Stanley T. Palmatier , Keith E. Miller , Anthony J. Melkent , William D. Armstrong
- Applicant Address: US IN Warsaw
- Assignee: Warsaw Orthopedic, Inc.
- Current Assignee: Warsaw Orthopedic, Inc.
- Current Assignee Address: US IN Warsaw
- Main IPC: A61F2/44
- IPC: A61F2/44 ; A61F2/30 ; A61F2/28

Abstract:
An intervertebral implant is provided. The intervertebral implant comprises a first component comprising an outer tissue engaging surface and an inner surface. A second component is connected to the first component, and is relatively moveable thereform. The second component comprises an outer tissue engaging surface and an inner surface. The second component includes an actuator. A third component is disposed for engagement and is movable relative to the first and second components. The third component comprises at least a first ramp and a second ramp axially spaced apart from the first ramp. The actuator is engageable with the third component to effect axial translation of the wedge such that the ramps engage the inner surface of at least one of the first component and the second component to move the components between a first, collapsed configuration and a second, expanded configuration. Methods of use are disclosed.
Public/Granted literature
- US20130158664A1 EXPANDABLE INTERBODY IMPLANT AND METHODS OF USE Public/Granted day:2013-06-20
Information query
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