Invention Grant
- Patent Title: Hypodermic needle assembly and related methods
- Patent Title (中): 皮下针组装及相关方法
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Application No.: US13791885Application Date: 2013-03-08
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Publication No.: US09446190B2Publication Date: 2016-09-20
- Inventor: Gary E. Miller
- Applicant: Gary E. Miller
- Applicant Address: US MN Mayer
- Assignee: MEDTECH SYSTEMS INC.
- Current Assignee: MEDTECH SYSTEMS INC.
- Current Assignee Address: US MN Mayer
- Agency: Cardle Patent Law CHTD
- Main IPC: A61M5/00
- IPC: A61M5/00 ; A61M5/162 ; A61M5/32 ; A61M5/34

Abstract:
A needle assembly for a hypodermic syringe is disclosed herein. In various aspects, the needle assembly includes a hub and a needle. A bond secures the needle to the hub, and the bond is configured to break allowing the needle to be withdrawn entirely from the hub upon application of a selected axial force to the needle, in various aspects. The axial force may be less than the tensile strength of the needle. Related methods of use of the needle assembly apparatus are disclosed herein.This Abstract is presented to meet requirements of 37 C.F.R. §1.72(b) only. This Abstract is not intended to identify key elements of the apparatus and the related methods disclosed herein or to delineate the scope thereof.
Public/Granted literature
- US20130237949A1 HYPODERMIC NEEDLE ASSEMBLY AND RELATED METHODS Public/Granted day:2013-09-12
Information query
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