Invention Grant
US09446566B2 Laminate, method for cutting laminate, method for processing laminate, and device and method for cutting brittle plate-like object
有权
层压板，层压板的切割方法，层叠体的加工方法，切断脆性板状物体的装置及方法
- Patent Title: Laminate, method for cutting laminate, method for processing laminate, and device and method for cutting brittle plate-like object
- Patent Title (中): 层压板，层压板的切割方法，层叠体的加工方法，切断脆性板状物体的装置及方法
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Application No.: US14117127Application Date: 2012-05-14
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Publication No.: US09446566B2Publication Date: 2016-09-20
- Inventor: Yoshiharu Miwa , Yoshinori Hasegawa , Takayuki Noda , Hiroki Mori , Michiharu Eta
- Applicant: Yoshiharu Miwa , Yoshinori Hasegawa , Takayuki Noda , Hiroki Mori , Michiharu Eta
- Applicant Address: JP Shiga
- Assignee: NIPPON ELECTRIC GLASS CO., LTD.
- Current Assignee: NIPPON ELECTRIC GLASS CO., LTD.
- Current Assignee Address: JP Shiga
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2011-108458 20110513; JP2011-247451 20111111; JP2011-252966 20111118
- International Application: PCT/JP2012/062304 WO 20120514
- International Announcement: WO2012/157610 WO 20121122
- Main IPC: B32B17/10
- IPC: B32B17/10 ; C03B33/07 ; C03B33/09 ; C03B33/04 ; B28D1/22 ; B23K26/08 ; B32B3/02 ; B32B3/30 ; B32B7/12 ; C03B21/02 ; B23K26/40 ; B29C67/00 ; B32B37/14 ; G02F1/1333
Abstract:
Provided is a laminate (1) obtained by integrally laminating glass sheets (4) on both surfaces of a resin sheet (2). The glass sheets (4) have a thickness of 300 μm or less and end surfaces (4a) of the glass sheets (4) are chamfered.
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