Invention Grant
US09446574B2 Method for bonding plastics and method for releasing a bond in the plastic composite and a plastic composite
有权
粘合塑料的方法和释放塑料复合材料中的粘合剂的方法以及塑料复合材料
- Patent Title: Method for bonding plastics and method for releasing a bond in the plastic composite and a plastic composite
- Patent Title (中): 粘合塑料的方法和释放塑料复合材料中的粘合剂的方法以及塑料复合材料
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Application No.: US14375960Application Date: 2013-01-29
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Publication No.: US09446574B2Publication Date: 2016-09-20
- Inventor: Cordelia Zimmerer , Gerald Steiner , Gert Heinrich
- Applicant: LEIBNIZ-INSTITUT FUER POLYMERFORSCHUNG DRESDEN E.V.
- Applicant Address: DE Dresden
- Assignee: LEIBNIZ-INSTITUT FUER POLYMERFORSCHUNG DRESDEN E.V.
- Current Assignee: LEIBNIZ-INSTITUT FUER POLYMERFORSCHUNG DRESDEN E.V.
- Current Assignee Address: DE Dresden
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: DE102012201426 20120201
- International Application: PCT/EP2013/051631 WO 20130129
- International Announcement: WO2013/113676 WO 20130808
- Main IPC: B29C65/14
- IPC: B29C65/14 ; B32B38/00 ; B29C65/36 ; B29C65/76 ; B29C65/00 ; B32B27/08 ; B32B27/28 ; B32B27/30 ; B32B37/06 ; B32B38/10 ; B32B43/00 ; C08J5/12 ; B29K705/14 ; B29K505/14 ; B29C65/50
Abstract:
The invention relates to the field of chemistry and concerns a method suitable for example for use in the automotive industry or in aircraft construction. The object of the present invention is to provide a method by which a bonding of the regions of the plastics that are in direct contact is accomplished. The object is achieved by a method for bonding plastics in which materials which contain at least one electrically conductive material and only partially cover the plastics are applied to at least one of the plastics to be bonded, then the plastics are brought into contact with one another, at least in the region with the materials, and after that at least this region is exposed at least once to an alternating electromagnetic field.
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