Invention Grant
- Patent Title: Liquid ejecting head and liquid ejecting apparatus
- Patent Title (中): 液体喷头和液体喷射装置
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Application No.: US14204446Application Date: 2014-03-11
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Publication No.: US09446589B2Publication Date: 2016-09-20
- Inventor: Shunsuke Watanabe , Katsumi Enomoto
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Workman Nydegger
- Priority: JP2013-059606 20130322
- Main IPC: B41J2/015
- IPC: B41J2/015 ; B41J2/14 ; B41J2/055
Abstract:
A liquid ejecting head includes a nozzle plate including a nozzle opening provided on a first surface of a flow path member with a flow path formed therein, and a protective member including a flexible portion that seals a portion of the flow path provided on the first surface of the flow path member. A position of a portion of the flow path member onto which the nozzle plate is attached and a position of a portion of the flow path member onto which the protective member is attached are different from one another in a discharge direction of a liquid.
Public/Granted literature
- US20140285582A1 LIQUID EJECTING HEAD AND LIQUID EJECTING APPARATUS Public/Granted day:2014-09-25
Information query
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