Invention Grant
US09447308B2 Curable silicone compositions, electrically conductive silicone adhesives, methods of making and using same, and electrical devices containing same
有权
可固化的硅氧烷组合物，导电性硅氧烷粘合剂，制造和使用它们的方法以及含有它们的电气装置
- Patent Title: Curable silicone compositions, electrically conductive silicone adhesives, methods of making and using same, and electrical devices containing same
- Patent Title (中): 可固化的硅氧烷组合物，导电性硅氧烷粘合剂，制造和使用它们的方法以及含有它们的电气装置
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Application No.: US14775789Application Date: 2014-03-13
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Publication No.: US09447308B2Publication Date: 2016-09-20
- Inventor: John Albaugh , Brian Chislea , Adriana Zambova
- Applicant: Dow Corning Corporation
- Applicant Address: US MI Midland
- Assignee: DOW CORNING CORPORATION
- Current Assignee: DOW CORNING CORPORATION
- Current Assignee Address: US MI Midland
- Agency: Dow Corning Corporation
- International Application: PCT/US2014/025149 WO 20140313
- International Announcement: WO2014/143627 WO 20140918
- Main IPC: C08K9/10
- IPC: C08K9/10 ; C09J9/02 ; C09J183/04 ; H01R4/04 ; C08K9/02 ; C08K3/08
Abstract:
A curable silicone composition comprising a curable organosiloxane composition, copper-silver (Cu—Ag) core-shell particles, and hydrocarbon vehicle; the curable silicone composition being characterizable by: a concentration of the Cu—Ag core-shell particles of from 70 to 89 weight percent and a total concentration of silver of from 7.0 to 14 weight percent, all based on weight of the curable silicone composition; wherein the composition remains curable to an electrically conductive silicone adhesive having a volume resistivity of less than 0.020 Ohm-centimeter measured according to Volume Resistivity Test Method.
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