Invention Grant
- Patent Title: Post bond perforation of a septum in an acoustic panel
- Patent Title (中): 在隔音板中的隔膜的后粘合穿孔
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Application No.: US14593664Application Date: 2015-01-09
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Publication No.: US09447576B2Publication Date: 2016-09-20
- Inventor: Rueichang Richard Liou , Sean Tiwari , Song Chiou , Dustin Cross
- Applicant: Rohr, Inc.
- Applicant Address: US CA Chula Vista
- Assignee: Rohr, Inc.
- Current Assignee: Rohr, Inc.
- Current Assignee Address: US CA Chula Vista
- Agency: O'Shea Getz P.C.
- Main IPC: E04B1/86
- IPC: E04B1/86 ; E04B1/82
Abstract:
Acoustic panels and methods for manufacturing acoustic panels are provided. In one such method, a core structure is provided between and bonded to a top skin and a septum. A plurality of perforations are formed in the top skin using an energy beam device. A plurality of perforations are formed in the septum through the top skin holes using the energy beam device. A plurality of cavities in the core structure fluidly couple at least some of the perforations in the top skin with at least some of the perforations in the septum.
Public/Granted literature
- US20160201317A1 POST BOND PERFORATION OF A SEPTUM IN AN ACOUSTIC PANEL Public/Granted day:2016-07-14
Information query
IPC分类:
