Invention Grant
- Patent Title: Electronic apparatus
- Patent Title (中): 电子仪器
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Application No.: US14330792Application Date: 2014-07-14
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Publication No.: US09448590B2Publication Date: 2016-09-20
- Inventor: Yuichi Hirai , Shingo Koide
- Applicant: Kabushiki Kaisha Toshiba
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Rutan & Tucker, LLP
- Agent William W. Schaal
- Main IPC: G06F1/16
- IPC: G06F1/16

Abstract:
According to one embodiment, an apparatus includes a board, a module, cables, and an insulator. The module includes a module body having a first end portion protruding to form a step and module terminals attached to the first end portion. The first end portion is thinner than a main portion of the module body. The protrusion height of the module terminal is less than that of the step. The cables have cable terminals fixed to the module terminals. The insulator has a first adhesive portion adhered to an adhesive point arranged on the back side to the first surface opposite to the board, a second adhesive portion adhered to the first surface, and a cover portion continued to the second adhesive portion and covering the cable terminal between both adhesive portions.
Public/Granted literature
- US20150103493A1 ELECTRONIC APPARTUS Public/Granted day:2015-04-16
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