Invention Grant
- Patent Title: Electronic device with serviceable CPU
- Patent Title (中): 具有可维修CPU的电子设备
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Application No.: US14028655Application Date: 2013-09-17
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Publication No.: US09448597B2Publication Date: 2016-09-20
- Inventor: Aaron R. Cox , Zhen De Fu , Lei R. Li , Jason E. Minyard , Joni E. Saylor
- Applicant: Lenovo Enterprise Solutions (Singapore) Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE. LTD.
- Current Assignee: LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE. LTD.
- Current Assignee Address: SG Singapore
- Agency: Roberts Mlotkowski Safran Cole & Calderon, P.C.
- Agent Katherine S. Brown; Andrew M. Calderon
- Main IPC: G06F1/18
- IPC: G06F1/18 ; H05K7/14 ; G06F1/20 ; H01L23/40

Abstract:
An electronic device includes an opening in a cover, a sleeve extending from the opening to a circuit board, and a CPU assembly. The CPU assembly includes a CPU carrier and is insertable into the sleeve to connect the CPU carrier with a CPU connector upon the circuit board. A method of installing the CPU assembly into the electronic device includes inserting the CPU assembly into a an opening in a cover of the electronic device within a sleeve extending from the opening to a circuit board. A serviceable CPU assembly includes a CPU carrier thermally connected to an underside of a lower portion of a heat sink, a CPU assembly base including a plurality of guidance features to properly align CPU assembly during installation, and a handle assembly comprising at least one handle connected to an upper portion of the heat sink.
Public/Granted literature
- US20150077931A1 ELECTRONIC DEVICE WITH SERVICEABLE CPU Public/Granted day:2015-03-19
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