Invention Grant
US09449653B2 Memory chip package having optically and electrically connected chips, memory system having the same and driving method thereof
有权
具有光学和电连接的芯片的存储器芯片封装，具有相同的存储器系统及其驱动方法
- Patent Title: Memory chip package having optically and electrically connected chips, memory system having the same and driving method thereof
- Patent Title (中): 具有光学和电连接的芯片的存储器芯片封装，具有相同的存储器系统及其驱动方法
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Application No.: US14094813Application Date: 2013-12-03
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Publication No.: US09449653B2Publication Date: 2016-09-20
- Inventor: Jeong-Kyoum Kim , Indal Song , Junghwan Choi
- Applicant: Jeong-Kyoum Kim , Indal Song , Junghwan Choi
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Volentine & Whitt, PLLC
- Priority: KR10-2013-0027383 20130314
- Main IPC: G11C5/06
- IPC: G11C5/06 ; H01L25/065 ; G11C5/02
Abstract:
A memory chip package includes memory chips stacked, electrically connected one another, and configured to input and output an optical signal through an optical line formed by a via penetrating the memory chips. The memory chips input and output optical signals with different wavelengths, and each of the memory chips has an optical-electrical converter configured to convert an optical signal with a corresponding wavelength into an electrical signal and to convert an electrical signal into an optical signal with the corresponding wavelength.
Public/Granted literature
- US20140268980A1 MEMORY CHIP PACKAGE, MEMORY SYSTEM HAVING THE SAME AND DRIVING METHOD THEREOF Public/Granted day:2014-09-18
Information query
