Invention Grant
- Patent Title: Semiconductor device and formation thereof
- Patent Title (中): 半导体器件及其形成
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Application No.: US15130032Application Date: 2016-04-15
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Publication No.: US09449886B2Publication Date: 2016-09-20
- Inventor: I-Wen Wu , Hsien-Cheng Wang , Hsin-Ying Lin , Mei-Yun Wang , Hsiao-Chiu Hsu , Shih-Wen Liu
- Applicant: Taiwan Semiconductor Manufacturing Company Limited
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee Address: TW Hsin-Chu
- Agency: Cooper Legal Group, LLC
- Main IPC: H01L21/8238
- IPC: H01L21/8238 ; H01L21/762 ; H01L21/8234

Abstract:
A semiconductor device and method of formation are provided herein. A semiconductor device includes a first active region adjacent a first side of a shallow trench isolation (STI) region. The first active region including a first proximal fin having a first proximal fin height adjacent the STI region, and a first distal fin having a first distal fin height adjacent the first proximal fin, the first proximal fin height less than the first distal fin height. The STI region includes oxide, the oxide having an oxide volume, where the oxide volume is inversely proportional to the first proximal fin height. A method of formation includes forming a first proximal fin with a first proximal fin height less than a first distal fin height of a first distal fin, such that the first proximal fin is situated between the first distal fin and an STI region.
Public/Granted literature
- US20160233131A1 SEMICONDUCTOR DEVICE AND FORMATION THEREOF Public/Granted day:2016-08-11
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