Invention Grant
US09449942B1 Method of making RFID devices on fabrics by stitching metal wires
有权
通过拼接金属线在织物上制造RFID设备的方法
- Patent Title: Method of making RFID devices on fabrics by stitching metal wires
- Patent Title (中): 通过拼接金属线在织物上制造RFID设备的方法
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Application No.: US14803803Application Date: 2015-07-20
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Publication No.: US09449942B1Publication Date: 2016-09-20
- Inventor: Weifeng Liu , Murad Kurwa , Anwar Mohammed , Zhen Feng
- Applicant: Flextronics AP, LLC
- Applicant Address: US CA San Jose
- Assignee: Flextronics AP, LLC
- Current Assignee: Flextronics AP, LLC
- Current Assignee Address: US CA San Jose
- Agency: Volpe and Koenig, P.C.
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L21/56 ; H01L21/28
Abstract:
A method for making a Radio Frequency Identification (RFID) device on fabric is described herein. In a first example, an RFID semiconductor chip is attached to a piece of fabric. The RFID semiconductor chip includes two terminals. A solid wire is stitched into the fabric making an RFID antenna. The solid wire is attached to the terminals of the RFID semiconductor chip. In a second example, a metal wire is selected. The metal wire is stitched into fabric making an RFID antenna. The metal wire includes two ends and a conductive adhesive is applied to two ends of the metal wire. An RFID semiconductor chip is attached to the fabric. The RFID semiconductor chip includes two terminals and the RFID semiconductor chip is attached to the fabric at the two terminals. The conductive adhesive is cured. In both examples, the wire and the RFID semiconductor chip are encapsulated in fabric.
Information query
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