Invention Grant
US09449984B2 Vertical NAND device with low capacitance and silicided word lines
有权
具有低电容和硅化字线的垂直NAND器件
- Patent Title: Vertical NAND device with low capacitance and silicided word lines
- Patent Title (中): 具有低电容和硅化字线的垂直NAND器件
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Application No.: US14465099Application Date: 2014-08-21
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Publication No.: US09449984B2Publication Date: 2016-09-20
- Inventor: Johann Alsmeier , Peter Rabkin
- Applicant: SANDISK TECHNOLOGIES, INC.
- Applicant Address: US TX Plano
- Assignee: SANDISK TECHNOLOGIES LLC
- Current Assignee: SANDISK TECHNOLOGIES LLC
- Current Assignee Address: US TX Plano
- Agency: The Marbury Law Group PLLC
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L27/115 ; H01L21/28 ; H01L21/764 ; H01L29/792 ; H01L29/49 ; H01L29/51

Abstract:
A three dimensional memory device including a substrate and a semiconductor channel. At least one end portion of the semiconductor channel extends substantially perpendicular to a major surface of the substrate. The device also includes at least one charge storage region located adjacent to semiconductor channel and a plurality of control gate electrodes having a strip shape extending substantially parallel to the major surface of the substrate. The plurality of control gate electrodes include at least a first control gate electrode located in a first device level and a second control gate electrode located in a second device level located over the major surface of the substrate and below the first device level. Each of the plurality of control gate electrodes includes a first edge surface which is substantially free of silicide, the first edge surface facing the semiconductor channel and the at least one charge storage region and a silicide located on remaining surfaces of the control gate electrode.
Public/Granted literature
- US20140361360A1 VERTICAL NAND DEVICE WITH LOW CAPACITANCE AND SILICIDED WORD LINES Public/Granted day:2014-12-11
Information query
IPC分类: