Invention Grant
US09449984B2 Vertical NAND device with low capacitance and silicided word lines 有权
具有低电容和硅化字线的垂直NAND器件

Vertical NAND device with low capacitance and silicided word lines
Abstract:
A three dimensional memory device including a substrate and a semiconductor channel. At least one end portion of the semiconductor channel extends substantially perpendicular to a major surface of the substrate. The device also includes at least one charge storage region located adjacent to semiconductor channel and a plurality of control gate electrodes having a strip shape extending substantially parallel to the major surface of the substrate. The plurality of control gate electrodes include at least a first control gate electrode located in a first device level and a second control gate electrode located in a second device level located over the major surface of the substrate and below the first device level. Each of the plurality of control gate electrodes includes a first edge surface which is substantially free of silicide, the first edge surface facing the semiconductor channel and the at least one charge storage region and a silicide located on remaining surfaces of the control gate electrode.
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