Invention Grant
- Patent Title: Semiconductor device and IC card
- Patent Title (中): 半导体器件和IC卡
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Application No.: US13238763Application Date: 2011-09-21
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Publication No.: US09449999B2Publication Date: 2016-09-20
- Inventor: Shunpei Yamazaki
- Applicant: Shunpei Yamazaki
- Applicant Address: JP Kanagawa-ken
- Assignee: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Current Assignee: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Current Assignee Address: JP Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office
- Agent Eric J. Robinson
- Main IPC: H01L27/13
- IPC: H01L27/13 ; G06K19/07 ; G06K19/077 ; G06K19/14 ; H01L27/12

Abstract:
The present invention provides an ID chip or an IC card in which the mechanical strength of an integrated circuit can be enhanced without suppressing a circuit scale. An ID chip or an IC card of the present invention has an integrated circuit in which a TFT (a thin film transistor) is formed from an insulated thin semiconductor film. Further, an ID chip or an IC card of the present invention has a light-emitting element and a light-receiving element each using a non-single-crystal thin film for a layer conducting photoelectric conversion. Such a light-emitting element or a light-receiving element may be formed consecutively to (integrally with) an integrated circuit or may be formed separately and attached to an integrated circuit.
Public/Granted literature
- US20120007096A1 ID CHIP AND IC CARD Public/Granted day:2012-01-12
Information query
IPC分类: