Invention Grant
- Patent Title: Method for forming lateral super-junction structure
- Patent Title (中): 形成横向超结结构的方法
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Application No.: US14747961Application Date: 2015-06-23
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Publication No.: US09450045B1Publication Date: 2016-09-20
- Inventor: Madhur Bobde , Lingpeng Guan , Karthik Padmanabhan , Hamza Yilmaz
- Applicant: Alpha and Omega Semiconductor Incorporated
- Applicant Address: US CA Sunnyvale
- Assignee: Alpha and Omega Semiconductor Incorporated
- Current Assignee: Alpha and Omega Semiconductor Incorporated
- Current Assignee Address: US CA Sunnyvale
- Agency: Van Pelt, Yi & James LLP
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L29/06 ; H01L29/78 ; H01L29/10 ; H01L21/265 ; H01L21/324

Abstract:
A fabrication method to form a lateral superjunction structure in a semiconductor device uses N and P type ion implantations into a base epitaxial layer. In some embodiments, the base epitaxial layer is an intrinsic epitaxial layer or a lightly doped epitaxial layer. The method performs simultaneous N and P type ion implantations into the base epitaxial layer. The epitaxial and implantation processes are repeated successively to form multiple implanted base epitaxial layers on a semiconductor base layer. After the desired number of implanted base epitaxial layers is formed, the semiconductor structure is subjected to annealing to form a lateral superjunction structure including alternate N and P type thin semiconductor regions. In particular, the alternating N and P type thin superjunction layers are formed by the ion implantation process and subsequent annealing. The fabrication method of the present invention ensures good charge control in the lateral superjunction structure.
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