Invention Grant
- Patent Title: Dislocation in SiC semiconductor substrate
- Patent Title (中): SiC半导体衬底中的位错
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Application No.: US14535642Application Date: 2014-11-07
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Publication No.: US09450054B2Publication Date: 2016-09-20
- Inventor: Taro Nishiguchi , Shin Harada , Shinsuke Fujiwara
- Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Applicant Address: JP Osaka-shi, Osaka
- Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee Address: JP Osaka-shi, Osaka
- Agency: Drinker Biddle & Reath LLP
- Priority: JP2011-280863 20111222; JP2011-280864 20111222; JP2011-280865 20111222
- Main IPC: H01L29/16
- IPC: H01L29/16 ; H01L29/32 ; H01L29/66 ; H01L29/78 ; H01L29/04 ; C30B23/00 ; C30B29/36 ; C30B23/02

Abstract:
A semiconductor substrate has a main surface and formed of single crystal silicon carbide. The main surface includes a central area, which is an area other than the area within 5 mm from the outer circumference. When the central area is divided into square areas of 1 mm×1 mm, in any square area, density of dislocations of which Burgers vector is parallel to direction is at most 1×105 cm−2. Thus, a silicon carbide semiconductor substrate enabling improved yield of semiconductor devices can be provided.
Public/Granted literature
- US09184239B2 Dislocation in SiC semiconductor substrate Public/Granted day:2015-11-10
Information query
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