Invention Grant
- Patent Title: Semiconductor device and method for producing a semiconductor device
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US14548375Application Date: 2014-11-20
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Publication No.: US09450085B2Publication Date: 2016-09-20
- Inventor: Till Schloesser , Andreas Meiser
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Eschweiler & Associates, LLC
- Priority: DE102013112887 20131121
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/10 ; H01L29/66 ; H01L29/06 ; H01L29/08 ; H01L29/417

Abstract:
A semiconductor device includes a semiconductor substrate having first regions of a first conductivity type and body regions of the first conductivity type, which are arranged in a manner adjoining the first region and overlap the latter in each case on a side of the first region which faces a first surface of the semiconductor substrate, and having a multiplicity of drift zone regions arranged between the first regions and composed of a semiconductor material of a second conductivity type, which is different than the first conductivity type. The first regions and the drift zone regions are arranged alternately and form a superjunction structure. The semiconductor device further includes a gate electrode formed in a trench in the semiconductor substrate.
Public/Granted literature
- US20150137226A1 Semiconductor Device and Method for Producing a Semiconductor Device Public/Granted day:2015-05-21
Information query
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