Invention Grant
US09450137B2 Apparatus and method for mounting contact wires on solar cell wafers
有权
将接触线安装在太阳能电池晶片上的装置和方法
- Patent Title: Apparatus and method for mounting contact wires on solar cell wafers
- Patent Title (中): 将接触线安装在太阳能电池晶片上的装置和方法
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Application No.: US14442617Application Date: 2013-11-13
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Publication No.: US09450137B2Publication Date: 2016-09-20
- Inventor: Benjamin Krause , Christoph Ponisch , Gunter Itta , Martin Seifried
- Applicant: Schmid Technology Systems GmbH
- Applicant Address: DE
- Assignee: Schmid Technology Systems GmbH
- Current Assignee: Schmid Technology Systems GmbH
- Current Assignee Address: DE
- Agency: Akerman LLP
- Priority: DE102012220815 20121114
- International Application: PCT/EP2013/073736 WO 20131113
- International Announcement: WO2014/076134 WO 20140522
- Main IPC: H01L31/18
- IPC: H01L31/18 ; H01L31/05

Abstract:
A device and a method for fitting solar cell contact wires providing a series connection, and which run continuously in a string direction to join a front solar cell wafer and a rear solar cell wafer.The device includes a wire-laying mechanism having a wire feed gripper, a wire transport gripper movable in the string direction relative to the wire feed gripper, a wire-holding gripper to grip and hold the contact wires behind the wafer-holding position for the rear solar cell wafer, and a wire cutter. Once a front solar cell wafer has been positioned, the contact wires are transferred from the wire feed gripper to the wire transport gripper, are advanced in the string direction over the wafer-holding position, are gripped and held by the wire-holding gripper, and are then cut behind the wire-holding gripper by the wire cutter.
Public/Granted literature
- US20160155887A1 Apparatus and Method for Mounting Contact Wires on Solar Cell Wafers Public/Granted day:2016-06-02
Information query
IPC分类: