A high speed connector assembly includes two interengaging connector halves each held in respective first and second interengaging connector housings. Each of the connector halves includes a plurality of conductive contacts arranged in at least two linear arrangements and at least partially surrounded by a conductive grounding shield. The connector housings are cylindrical and engage each other in a circular fashion, while the connectors engage each other in a linear, axial fashion. The connector housings provide a sealed environment for the connectors.