Invention Grant
- Patent Title: Package module of battery protection circuit
- Patent Title (中): 电池保护电路封装模块
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Application No.: US14351321Application Date: 2012-08-20
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Publication No.: US09450428B2Publication Date: 2016-09-20
- Inventor: Hyeok-Hwi Na , Young-Seok Kim , Sang-Hoon Ahn , Sung-Beum Park , Seung-Wook Park , Hyun-Mok Cho , Sun-Bok Park , Jae-Goo Park , Ho-Suk Hwang
- Applicant: Hyeok-Hwi Na , Young-Seok Kim , Sang-Hoon Ahn , Sung-Beum Park , Seung-Wook Park , Hyun-Mok Cho , Sun-Bok Park , Jae-Goo Park , Ho-Suk Hwang
- Applicant Address: KR Chungbuk
- Assignee: ITM SEMICONDUCTOR CO., LTD.
- Current Assignee: ITM SEMICONDUCTOR CO., LTD.
- Current Assignee Address: KR Chungbuk
- Agency: Ladas & Parry LLP
- Priority: KR10-2011-0103628 20111011
- International Application: PCT/KR2012/006593 WO 20120820
- International Announcement: WO2013/055026 WO 20130418
- Main IPC: H02J7/00
- IPC: H02J7/00 ; H02H1/00 ; H02H3/08 ; H02H7/18 ; H01M10/42 ; H01M2/34 ; H01M10/0525 ; H01M2/02 ; H01M2/04

Abstract:
Disclosed is a package module of a battery protection circuit. The package module comprises: a first internal connection terminal area and a second internal connection terminal area, and in which first and second internal connection terminals connected to a battery can provided with a bare cell are respectively disposed; an external connection terminal area, in which a plurality of external connection terminals are disposed; and a protection circuit area comprising a device area in which a plurality of passive devices forming the battery protection circuit are disposed and a chip area, which is adjacent to the device area, and in which a protection IC and a dual FET chip forming the battery protection circuit are disposed, are disposed between the external connection terminal area and the second internal connection terminal area.
Public/Granted literature
- US20140347776A1 PACKAGE MODULE OF BATTERY PROTECTION CIRCUIT Public/Granted day:2014-11-27
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